Microwave energy is used during the implantation-annealing process of semic
onductors where it is shown that the implant ion damage anneal takes place
at the same time as the implantation step. The microwave energy is observed
to be focused within the plasma volume created by the electron-hole pairs,
where the conductivity is increased considerably. It is shown that the imp
lantation takes place perpendicularly with respect to the wafer surface and
that there is very little lateral redistribution of ions. The transmission
electron microscopy and measurements of the implanted zone confirm the pre
dicted good results of this process. (C) 2000 American Institute of Physics
. [S0021-8979(00)02719-5].