Copper and copper compounds as coatings on polystyrene particles and as hollow spheres

Authors
Kawahashi, N Shiho, H
Citation
N. Kawahashi et H. Shiho, Copper and copper compounds as coatings on polystyrene particles and as hollow spheres, J MAT CHEM, 10(10), 2000, pp. 2294-2297
Citations number
19
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS CHEMISTRY
ISSN journal
09599428 → ACNP
Volume
10
Issue
10
Year of publication
2000
Pages
2294 - 2297
Database
ISI
SICI code
0959-9428(2000)10:10<2294:CACCAC>2.0.ZU;2-0
Abstract
Submicron-sized anionic polystyrene latices have been coated with uniform l ayers of copper compounds by aging dispersions of the polymer colloid in th e presence of aqueous solutions of Cu(NO3)(2), urea, and poly(N-vinylpyrrol idone) at 85 degrees C. The thickness and morphology of the deposited layer s can be altered by suitable adjustment of the reactant concentrations and the aging time. Hollow colloidal spheres of metallic copper and copper oxid e were obtained by calcination of the coated polystyrene latices at elevate d temperatures in nitrogen and air, respectively.