An inverse analysis for the heat conduction during a grinding process

Authors
Citation
Kk. Hong et Cy. Lo, An inverse analysis for the heat conduction during a grinding process, J MATER PR, 105(1-2), 2000, pp. 87-94
Citations number
12
Categorie Soggetti
Material Science & Engineering
Journal title
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY
ISSN journal
09240136 → ACNP
Volume
105
Issue
1-2
Year of publication
2000
Pages
87 - 94
Database
ISI
SICI code
0924-0136(20000907)105:1-2<87:AIAFTH>2.0.ZU;2-V
Abstract
A numerical method is applied to analyze the heat-conduction problem in a g rinding process. At the beginning, the time and space domains of the proble m are discretized based on the finite difference method and then a linear i nverse model, in which the solution procedure requires no iteration, is con structed to identify the temperature distribution and the heat flux along t he cutting path. The excess heat generated in the grinding process may caus e thermal damage to the workpieces and the wheels, however, direct measurem ent is extremely difficult or simply impossible in the contact zone of the grinding process. The inverse approach provides an alternative. According t o this study, a few data measured wherever the temperature measurement can be done are sufficient to determine the temperature and the heat flux on th e workpiece surface. (C) 2000 Elsevier Science S.A. All rights reserved.