Laser drilling technique for multilayer ceramic chip component and module

High-speed laser drilling using low laser power and flexible circuit layout changes was applied to form 3-dimensional circuits in multilayer ceramics to fabricate miniaturized chip inductors and high-frequency power amplifier modules. The optimized combination of pulse YAG laser energy and the laser absorption coefficient of machined materials enabled ultra-fine through-ho les to be formed in thin ceramic green sheets without damaging supporting p lastic him where ceramic slurry was cast. Drilling basically involved therm al ablation.