A. Matsuda et al., Thermal softening behavior of poly (phenylsilsesquioxane) and poly (benzylsilsesquioxane) particles, J CERAM S J, 108(9), 2000, pp. 830-835
The thermal softening behavior of poly(phenylsilsesquioxane) (PhSiO3/2) and
paly(benzylsilsesquioxane) (BnSiO3/2) particles during heat treatment has
been investigated from the results of gel permeation chromatography, therma
l and structural analyses of the particles. Both PhSiO3/2 and BnSiO3/2 part
icles thermally softened, and the on-set temperature of thermal sintering w
as about 140 and 50 degrees C for PhSiO3/2 and BnSiO3/2. respectively. The
thermal sintering of the PhSiO3/2 and BnSiO3/2 particles was caused by the
decrease of viscosity at temperatures higher than the glass transition temp
eratures. Glass transition was observed for BnSiO3/2 in the repeated heatin
g runs, while for PhSiO3/2 glass transition was appreciable only in the fir
st heating run. From Si-29 nuclear magnetic resonance spectra, the developm
ent of siloxane network during heat treatment was found to be more signific
ant in PhSiO3/2 than in BnSiO3/2. The difference in the structural evolutio
n during heat treatment makes PhSiO3/2 particles thermosetting and BnSiO3/2
ones thermoplastic.