This paper is a survey of a new class of Hall devices which are not plate-l
ike but have three-dimensional structures. The survey covers: the vertical
Hall device, sensitive to a magnetic field parallel with the chip surface;
the cylindrical Hall device, which behaves as a vertical Hall device combin
ed with magnetic flux concentrators; the two-axis vertical Hall device, for
the two in-chip-plane components of a magnetic field: and the three-axis H
all device, to measure all three components of a magnetic field. All these
Hall magnetic sensors an fabricated using the "vertical Hall" silicon proce
ss and feature low supply current, low noise, and high long-term stability.
Their applications include: high-accuracy magnetometry, long-range positio
n sensing, angular position sensing, current sensing, magnetic scanning of
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