Micro-springs for temporary chip connections

The idea of Composite IC is an assembly concept for multi-chip assembly tha t allows to detect and exchange defective components before final mounting and encapsulation. This paper describes the fabrication process and the cha racterization of a scalable micro-spring design that has the potential of m eeting the mechanical requirements of the Composite IC concept. An FEM simu lation model capable of predicting the mechanical properties of future desi gn variations is shown. (C) 2000 Elsevier Science S.A. All rights reserved.