This paper reports on a characterization of structures fabricated by electr
ochemical etching in hydrofluoric acid (HF) using different types of initia
l pits. An initial pit has been thought to require a sharp tip in order to
collect electronic holes generated by illumination. Therefore, the initial
pits have been formed by etching in a KOH solution, which suffers from crys
tal orientation dependence. We successfully demonstrate the structures fabr
icated by the electrochemical etching with the initial pits, which have fla
t or round base. These pits are: formed by isotropic wet etching or reactiv
e ion etching (RIE), which are free from crystal orientation of silicon sub
strate. Furthermore, regular hole patterns can be achieved without initial
pits. This makes the electrochemical etching process mon simple. The electr
ic field in the silicon is calculated and the calculated results support th
e experimental results. (C) 2000 Elsevier Science S.A. All rights reserved.