Effects of O-2/N2O-plasma treatment on nitride films on strained Si

Citation
Lk. Bera et al., Effects of O-2/N2O-plasma treatment on nitride films on strained Si, SOL ST ELEC, 44(9), 2000, pp. 1533-1536
Citations number
27
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Eletrical & Eletronics Engineeing
Journal title
SOLID-STATE ELECTRONICS
ISSN journal
00381101 → ACNP
Volume
44
Issue
9
Year of publication
2000
Pages
1533 - 1536
Database
ISI
SICI code
0038-1101(200009)44:9<1533:EOOTON>2.0.ZU;2-4
Abstract
NH3 plasma grown ultrathin (<75 Angstrom) nitride films on strained Si have been oxidized using O-2- and N2O-plasma. It is observed that the electrica l properties and reliability of metal insulator semiconductor capacitors wi th N2O-plasma treated nitride films are better than those using O-2-plasma treated films. N2O-plasma treatment of nitride films has resulted in a low level of insulator charge density (Q(f)/q, 1.6 x 10(11) cm(-2)), a high bre akdown voltage (similar to 10-11 MV cm), a high charge-to-breakdown value ( Q(BD,) 11.7 C cm(-2)) and low leakage current. (C) 1000 Elsevier Science Lt d. All rights reserved.