Microstructure dependence of steady state creep in Cd-Sn eutectic alloy

The steady state creep of Sn-33 wt.% Cd alloy was studied under various con stant stresses ranging from 25.56 to 30.85 MPa in the temperature range fro m 353 to 433 K. The stress exponent n was found to change from 6.25 to 4.55 in the above temperature range. The energy activating the steady state cre ep amounted to 591.3 kJ/mol in the temperature range from 353 K to 393 K an d to 37 kJ/mol in the temperature range from 413 K to 433 K characterizing the grain boundary diffusion in Cd and in Sn; respectively. Microstructure analysis confirmed that the above mentioned mechanisms took place during st eady state creep.