OPTIMAL 3-DIMENSIONAL PLACEMENT OF HEAT GENERATING ELECTRONIC COMPONENTS

Authors
CAMPBELL MI AMON CH CAGAN J
Citation
Mi. Campbell et al., OPTIMAL 3-DIMENSIONAL PLACEMENT OF HEAT GENERATING ELECTRONIC COMPONENTS, Journal of electronic packaging, 119(2), 1997, pp. 106-113
Citations number
23
Categorie Soggetti
Engineering, Mechanical","Engineering, Eletrical & Electronic
Journal title
Journal of electronic packaging → ACNP
ISSN journal
10437398
Volume
119
Issue
2
Year of publication
1997
Pages
106 - 113
Database
ISI
SICI code
1043-7398(1997)119:2<106:O3POHG>2.0.ZU;2-X
Abstract
This work introduces an algorithm that uses simulated annealing to per form electronic component layout while incorporating constraints relat ed to thermal performance. A hierarchical heat transfer analysis is de veloped which is used in conjunction with the simulated annealing algo rithm to produce final layout configurations that are densely packed a nd operate within specified temperature ranges. Examples of three-dime nsional component placement test cases are presented including an appl ication to embedded wearable computers.