Enhanced skin effect for partial-element equivalent-circuit (PEEC) models

In this paper, a skin-effect modeling approach is presented that is suitabl e for all frequency regimes of interest and therefore is most appropriate f or transient interconnect analysis. Yet, the new formulation lends itself t o a model that can be abstracted for use in conjunction with surface integr al and finite difference-based electromagnetic tools for interconnect model ing. While a volume filament technique is not computationally feasible at h igh frequencies, where a fine discretization is necessary, the formulation that is presented avoids this difficulty by carefully casting the behavior of a conductor into the form of a global surface impedance, thus requiring fewer unknowns. Several examples illustrating the ability of the proposed m odel to accurately capture proximity and skin-effect behaviors will be show n. Interconnect resistance and inductance per-unit-length results are given and compared with those obtained using different models.