Impact of environment and interspecific interactions between spoilage fungi and Aspergillus ochraceus on growth and ochratoxin production in maize grain
Hb. Lee et N. Magan, Impact of environment and interspecific interactions between spoilage fungi and Aspergillus ochraceus on growth and ochratoxin production in maize grain, INT J F MIC, 61(1), 2000, pp. 11-16
Using layers of irradiated but still fertile maize grain, the effects of wa
ter activity (0.995, 0.95 a(w)) and temperature (18, 30 degrees C) on inter
specific interactions between Aspergillus ochraceus and five other spoilage
fungi were examined. Asp. ochraceus was not competitive against Asp. flavu
s, Asp. niger, or Alternaria alternate at 18 degrees C when water was freel
y available (0.995 a(w)), while at 0.95 a(w) it was dominant against Asp. c
andidus, Asp. flavus and Alt. alternata. At 30 degrees C and 0.995 a(w), As
p. ochraceus was dominated by other fungi, except Alt. alternata, and was m
utually antagonistic to Asp. candidus and Eurotium amstelodami. However, at
30 degrees C and 0.95 a(w) it was competitive against Asp. candidus and Al
t. alternata, but not against the other species examined. The overall Index
of Dominance showed that Asp. ochraceus was not competitive under the cond
itions examined here. At 18 degrees C ochratoxin production by Asp. ochrace
us was inhibited significantly by Asp. candidus (0.995 and 0.95 a(w)) and A
sp. niger (0.995 a(w)). When grown on maize grain at 30 degrees C, ochratox
in production by Asp. ochraceus was significantly inhibited by other spoila
ge fungi when both were grown on maize grain, especially by Asp. niger and
E. amstelodami (0.995 a(w)) and Asp. flavus at 0.95 a(w). These results sug
gest that, to a large extent, A. ochraceus is not as competitive as some ot
her spoilage fungi in primary resource capture on maize grain at a(w) of 0.
95 or above, although it may modify resource quality and influence secondar
y colonisation by other species under the conditions tested. (C) 2000 Elsev
ier Science B.V. All rights reserved.