Cu/CaF2/diamond metal-insulator-semiconductor field-effect transistor utilizing self-aligned gate fabrication process

Citation
H. Umezawa et al., Cu/CaF2/diamond metal-insulator-semiconductor field-effect transistor utilizing self-aligned gate fabrication process, JPN J A P 2, 39(9AB), 2000, pp. L908-L910
Citations number
15
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Volume
39
Issue
9AB
Year of publication
2000
Pages
L908 - L910
Database
ISI
SICI code
Abstract
High-performance metal-insulator-semiconductor field-effect transistors (MI S FET) on hydrogen-terminated homoepitaxial diamond films are demonstrated. The gate insulator is evaporated CaF2 which does not cause interface stale s. This is the first study of a CaF2/diamond MISFET fabricated by a self-al igned gate fabrication process by which the gate length and the source gate spacing are effectively reduced. The maximum transconductance is 86 mS/mm, which is the highest value in diamond MISFETs at present.