Interactions between plasmas in ionized physical vapor deposition discharges

Citation
Y. Andrew et al., Interactions between plasmas in ionized physical vapor deposition discharges, J VAC SCI A, 18(5), 2000, pp. 2137-2142
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS
ISSN journal
07342101 → ACNP
Volume
18
Issue
5
Year of publication
2000
Pages
2137 - 2142
Database
ISI
SICI code
0734-2101(200009/10)18:5<2137:IBPIIP>2.0.ZU;2-Z
Abstract
Ionized physical vapor deposition is of current interest for the thin film deposition of diffusion barriers and copper seed layers for interconnect me tallization. Experimental evidence of the interaction between the magnetron discharge and the inductively coupled plasma leading to lower plasma poten tials and direct current bias voltages than expected is presented. Such eff ects have major implications for radio frequency coil lifetimes, discharge uniformity, and simulations of such discharges. (C) 2000 American Vacuum So ciety.