Plasma-induced surface damage of a III-V compound semiconductor, a problem
associated with many device fabrication processes, is clarified with carefu
l measurements of surface defect density induced by low energy ion bombardm
ent of InP. In the study, n- and p-InP (110) surfaces were prepared by clea
vage of InP in ultrahigh vacuum, and then bombarded as a function of ion ty
pe (He+ and Ar+), energy (5-100 eV), and fluence (10(12)-10(17) ions/cm(2))
. The dynamic process of surface Fermi level shifting induced by such bomba
rdment was determined by in situ high-resolution x-ray photoelectron spectr
oscopy, and the data were then converted to information on surface defect f
ormation. It was found that both He+ and Ar+ bombardment with the above con
ditions moved the Fermi levels of both n- and p-InP (110) surfaces towards
0.95 eV above the valence band maximum of InP. As expected, for the same bo
mbardment energy, Ar+ caused more damage than He+, and for the same ion typ
e, the bombardment induced a surface defect density. increasing with both i
on energy and fluence. It was also found that the threshold condition for d
efect formation was a combined function of the impact energy of the incomin
g ion and the energy released during its neutralization. (C) 2000 American
Vacuum Society. [S0734-2101(00)02105-9].