Enhanced semi-empirical potentials in molecular dynamics simulations of wafer bonding

Citation
K. Scheerschmidt et al., Enhanced semi-empirical potentials in molecular dynamics simulations of wafer bonding, MAT SC S PR, 3(1-2), 2000, pp. 129-135
Citations number
16
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
ISSN journal
13698001 → ACNP
Volume
3
Issue
1-2
Year of publication
2000
Pages
129 - 135
Database
ISI
SICI code
1369-8001(200003)3:1-2<129:ESPIMD>2.0.ZU;2-G
Abstract
Molecular dynamics simulations using suitably fitted empirical potentials h ave been employed to describe atomic interactions at interfaces created by the macroscopic wafer bonding process. Investigating perfect or distorted s urfaces (steps, reconstruction, adsorbates, facets, mistilt, twist rotation ) of different semiconductor materials as well as of silica enables one to study the elementary processes and the resulting defects at the interfaces as well as to characterize the ability of the potentials used. Preliminary simulations on the basis of empirical potentials developed by the bond orde r tight-binding approximation, yield enhanced interface structures and ener getic relaxations as well as transferability to new materials systems. (C) 2000 Elsevier Science Ltd. All rights reserved.