Molecular dynamics simulations using suitably fitted empirical potentials h
ave been employed to describe atomic interactions at interfaces created by
the macroscopic wafer bonding process. Investigating perfect or distorted s
urfaces (steps, reconstruction, adsorbates, facets, mistilt, twist rotation
) of different semiconductor materials as well as of silica enables one to
study the elementary processes and the resulting defects at the interfaces
as well as to characterize the ability of the potentials used. Preliminary
simulations on the basis of empirical potentials developed by the bond orde
r tight-binding approximation, yield enhanced interface structures and ener
getic relaxations as well as transferability to new materials systems. (C)
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