New non-destructive laser ablation based backside sample preparation method

Authors
Beaudoin, F Saviot, F Lewis, D Perdu, P Salin, F
Citation
F. Beaudoin et al., New non-destructive laser ablation based backside sample preparation method, MICROEL REL, 40(8-10), 2000, pp. 1425-1429
Citations number
14
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
40
Issue
8-10
Year of publication
2000
Pages
1425 - 1429
Database
ISI
SICI code
0026-2714(200008/10)40:8-10<1425:NNLABB>2.0.ZU;2-2
Abstract
A new ultra-short pulse laser ablation based backside sample preparation me thod has been developed. This technique is contact-less, non-thermal, preci se, repetitive and adapted to each type of material present in IC packages. Backside preparation examples are presented on a conventional DIL plastic package, a TSOP plastic package with an oversized silicon die and on a DIL ceramic package. (C) 2000 Elsevier Science Ltd. All rights reserved.