A review of sample backside preparation techniques for VLSI

Authors
Perdu, P Desplats, R Beaudoin, F
Citation
P. Perdu et al., A review of sample backside preparation techniques for VLSI, MICROEL REL, 40(8-10), 2000, pp. 1431-1436
Citations number
5
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
40
Issue
8-10
Year of publication
2000
Pages
1431 - 1436
Database
ISI
SICI code
0026-2714(200008/10)40:8-10<1431:AROSBP>2.0.ZU;2-G
Abstract
A review of backside sample preparation techniques is presented. These tech niques cover mechanical, chemical and other novel approaches such as laser ablation for ceramic and plastic package opening, silicon thinning and sili con polishing. To illustrate the milling process, we present two challengin g backside sample preparation examples on a ceramic package and on a TSOP p ackage. (C) 2000 Elsevier Science Ltd. All rights reserved.