Principle and application of a bifunctional laser linking and cutting structure for microelectronic circuits in standard CMOS-technology

The combination of a laser link and fuse in one device results in a new bif unctional laser linking and cutting structure. This new laser switch unites a vertical link structure and a fuse in a vertical arrangement to reduce t he area requirements. The laser switch allows metal lines to be linked and disconnected simultaneously. Due to its excellent switch characteristics, i t is well suited for configuration and repair purposes in microelectronic c ircuits. This new approach reduces the processing time per bus defect by 50 %, in addition to lowering the area overhead by 20% for the laser structure . The structure has been designed and fabricated in a standard three-level metal CMOS process and has been successfully verified. The laser-links form ed exhibit a very low resistance (R-median= 1.7 Omega). Both linking and cu tting structures were processed with 100% yield. (C) 2000 Elsevier Science Ltd. All rights reserved.