Thermal stability of laser welded thermocouple contacts to Si for high temperature thermal sensor application

Citation
H. Ernst et al., Thermal stability of laser welded thermocouple contacts to Si for high temperature thermal sensor application, MICROEL REL, 40(8-10), 2000, pp. 1683-1688
Citations number
11
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
MICROELECTRONICS RELIABILITY
ISSN journal
00262714 → ACNP
Volume
40
Issue
8-10
Year of publication
2000
Pages
1683 - 1688
Database
ISI
SICI code
0026-2714(200008/10)40:8-10<1683:TSOLWT>2.0.ZU;2-0
Abstract
We report on the development of high temperature stable thermocouple contac ts to Si for thermal sensor applications. Such contacts can be used as a le ad for electrical signals while at the same time measuring the temperature immediately at the semiconductor surface. Contacts are fabricated by laser welding with a pulsed Nd:YAG laser. 50 mu m thick tungsten sheets are used as a. diffusion barrier. The long term stability of the contacts has been i nvestigated during heat treatment up to 500 degrees C in air and 700 degree s C in vacuum for up to 1000. hours, respectively. (C) 2000 Elsevier Scienc e Ltd. All rights reserved.