Packaging technique for gain enhancement of electrically small antenna designed on gallium arsenide

Citation
Ctp. Song et al., Packaging technique for gain enhancement of electrically small antenna designed on gallium arsenide, ELECTR LETT, 36(18), 2000, pp. 1524-1525
Citations number
7
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
ELECTRONICS LETTERS
ISSN journal
00135194 → ACNP
Volume
36
Issue
18
Year of publication
2000
Pages
1524 - 1525
Database
ISI
SICI code
0013-5194(20000831)36:18<1524:PTFGEO>2.0.ZU;2-P
Abstract
A novel method is presented for achieving a complete RF front end product e quipped with its radiator within a single chip package. This packaging tech nique provides an alternative solution to problems associated with reduced size antennas implemented on gallium arsenide (GaAs) substrates, such as re storation of the antenna gain by 15dB. This configuration will help to redu ce manufacturing costs associated with connecting the antenna to the RF fro nt-end chip.