Ctp. Song et al., Packaging technique for gain enhancement of electrically small antenna designed on gallium arsenide, ELECTR LETT, 36(18), 2000, pp. 1524-1525
A novel method is presented for achieving a complete RF front end product e
quipped with its radiator within a single chip package. This packaging tech
nique provides an alternative solution to problems associated with reduced
size antennas implemented on gallium arsenide (GaAs) substrates, such as re
storation of the antenna gain by 15dB. This configuration will help to redu
ce manufacturing costs associated with connecting the antenna to the RF fro
nt-end chip.