Since power devices require an electrically active, thick n-type silicon la
yer with high resistivity and a large area, their electrical characteristic
s are extremely sensitive to contamination. If transition metals diffuse in
to the wafers during the high temperature steps required for device fabrica
tion, an uncontrolled increase in leakage Current and on state voltage can
be observed. Further more, current filamentation and instabilities of the e
lectrical data can occur. As a consequence of the low doping level of the n
-base, the blocking voltage and the failure rate due to cosmic radiation ar
e sensitive to contaminating atoms acting as donors or accepters. To obtain
information about the sources and the extent of the contamination, a conta
mination check was performed after each high temperature step. Moreover, th
e dependence of the carrier lifetime on temperature and injection level was
analyzed for typical operation conditions of power devices. The results pr
oved to be important in finding ways of keeping contamination and silicon d
efect densities as low as possible and to ensure that good electrical data
with adequate stability could be obtained. (C) 2000 The Electrochemical Soc
iety. S0013-4651(00)05-045-X. All rights reserved.