Improve yields, enhance CDs with integrated DUV resist track

Detailed attention to the design of resist processing nozzle rinsing action and improved airflow around the developer catch-cup chamber, combined with physical process-parameter optimization, has achieved a significant reduct ion in defects during resist processing and wider process latitude. The ove rall effects include yield and throughput improvements using deep-UV resist s, which translate into enhanced cost of ownership, and the potential of mi nimizing chemical and deionized water consumption to meet stringent environ mental regulations. Further, we believe that the results presented here are applicable to smaller geometries and to 300mm wafers.