Ar. Stonas et al., Backside-illuminated photoelectrochemical etching for the fabrication of deeply undercut GaN structures, APPL PHYS L, 77(16), 2000, pp. 2610-2612
A photoelectrochemical (PEC) wet-etching technique (backside-illuminated PE
C) is described that utilizes the dopant or band-gap selectivity of PEC etc
hing to fabricate deeply undercut structures. Lateral etch rates exceeding
5 mu m/min have been observed, producing cantilevers in excess of 100 mu m
in length. Dramatically different etch morphologies were noted between the
frontside- and backside-illuminated etching, though dopant-dependent etch s
electivities were maintained. (C) 2000 American Institute of Physics. [S000
3-6951(00)02542-0].