Three-dimensional high-frequency distribution networks - Part II: Packaging and integration

Authors
Henderson, RM Herrick, KJ Weller, TM Robertson, SV Kihm, RT Katehi, LPB
Citation
Rm. Henderson et al., Three-dimensional high-frequency distribution networks - Part II: Packaging and integration, IEEE MICR T, 48(10), 2000, pp. 1643-1651
Citations number
20
Categorie Soggetti
Eletrical & Eletronics Engineeing
Journal title
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES
ISSN journal
00189480 → ACNP
Volume
48
Issue
10
Year of publication
2000
Pages
1643 - 1651
Database
ISI
SICI code
0018-9480(200010)48:10<1643:THDN-P>2.0.ZU;2-W
Abstract
This paper describes the implementation and packaging of the components, de scribed in Part I of this paper, to realize a three-dimensional W-band dist ribution network.