Lateral gettering has been studied by introducing cavities in the periphery
of large active devices. Cavities were induced by helium implantation foll
owed by a thermal treatment on samples previously contaminated by iron. Tho
se cavities are known to be efficient to trap metallic impurities in silico
n by chemisorption. The iron distribution in samples of 6x6 mm(2) area has
been monitored by measuring current versus voltage characteristics and inte
rstitial iron concentrations by deep level transient spectroscopy on Schott
ky diodes uniformly distributed. A symmetrical iron distribution has been o
bserved with a decreasing concentration close to the gettering region. This
lateral gettering is enhanced with increasing thermal budget. Extensions o
f several millimeters can be obtained allowing applications in power device
technology. (C) 2000 American Institute of Physics. [S0021-8979(00)03022-X
].