Thermal imidization of poly(amic acid) precursors on glycidyl methacrylate(GMA) graft-polymerized aluminium and copper surfaces

A novel method was developed to achieve good adhesion of polyimides (PI, Ka pton HN(R)) and fluorinated polyimides (FPI) on aluminium and copper surfac es via thermal imidization of the respective poly(amic acid) (PAA) and fluo rinated poly(amic acid) (FPAA) precursors onto the glycidyl methacrylate (G MA) graft-polymerized aluminium and copper substrates. The properly cleaned surfaces of the aluminium and copper foils were first silanized with 3-ami nopropy(triethoxysilane) (APS) (the APS-metal surface). The silanized alumi nium and copper foils were pretreated with Ar plasma to generate the surfac e peroxides and hydroperoxides before been subjected to UV-induced graft po lymerization with GMA (the GMA-g-APS-metal surface). The graft-polymerized metal surfaces were characterized by X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM). The 180 degrees-peel adhesion strength achieved with the use of GMA-g-APS-metal surface was about 10 N/cm, or abou t five times the value obtainable with the pristine metal surface. It was a lso found that the presence of fluorine-containing groups had negligible ef fect on the adhesion of the FPI to the present graft-modified metal substra tes. The high adhesion strength was attributed to the synergistic effect of coupling the curing of epoxide functional groups of the grafted GMA chains with the imidization process of the PAA or FPAA, and the fact that the GMA chains were covalently tethered onto the metal surface. The XPS results re vealed that the PI/GMA-g-APS-Cu laminate delaminated by cohesive failure in side the polyimide film. (C) 2000 EIsevier Science Ltd. All rights reserved .