Jr. Bates et al., THE INFLUENCE OF THE ELECTRODEPOSITION PARAMETERS ON THE MORPHOLOGY OF ORGANO-TRANSITION METAL-COMPLEXES FOR THIN-FILM GAS SENSOR APPLICATIONS, Thin solid films, 299(1-2), 1997, pp. 18-24
This paper describes the electrodeposition of tetrabutylammonium bis(1
,3-dithiol-2-thione-4,5-dithiolate) nickelate (Bu4NNi(dmit)(2)) onto p
latinum, gold interdigitated and fluoride-doped tin oxide electrodes.
The effects of adding pyrrole, thiophene, 3-methylthiophene and furan
to the deposition solution on the film morphology were investigated. T
he bulk conductivity of the deposited films was found to be 4 x 10(-2)
S cm(-1) irrespective of the heterocycle added. Cyclic voltammetry wa
s carried out using the three electrodes: the gold and platinum electr
odes showed similar electrochemical behaviour, with the peaks assigned
to the redox properties of the metal-dmit; the SnO2 electrode did not
yield any distinct peaks. It is suggested that this was because the r
ate of electron transfer to the SnO2 electrode was the rate-limiting s
tep rather than the rate of diffusion to the electrode surface as in t
he case of the platinum and gold electrodes. The films deposited onto
the interdigitated gold electrodes were exposed to sulphur dioxide and
changes in the film resistance were monitored. Films deposited in dic
hloromethane had a much lower surface area than those deposited from n
itrobenzene, and the magnitude of the change in resistance on exposure
to sulphur dioxide was a factor of four tower than for the films depo
sited in nitrobenzene. Studies were also carried out on copper and cob
alt dmit analogues; the copper-dmit behaved in a similar manner to the
nickel-dmit, although the films were of very low conductivity,whereas
the cobalt-dmit showed no reversible redox behaviour. (C) 1997 Elsevi
er Science S.A.