Special issue on packaging and soldering technologies for electronic interconnects - Foreword

Authors
Ghosh, G Weiser, M Mavoori, H Chada, S
Citation
G. Ghosh et al., Special issue on packaging and soldering technologies for electronic interconnects - Foreword, J ELEC MAT, 29(10), 2000, pp. 1111-1112
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
29
Issue
10
Year of publication
2000
Pages
1111 - 1112
Database
ISI
SICI code
0361-5235(200010)29:10<1111:SIOPAS>2.0.ZU;2-8