Jy. Park et al., Study on the soldering in partial melting state (1) analysis of surface tension and wettability, J ELEC MAT, 29(10), 2000, pp. 1145-1152
This paper introduces the partial melting process for solder application an
d characterization of its feasibility using Pb-Sn, Ag-Sn, Sn-Cu, Sn-In and
Sn-Bi alloys. In order to show that the liquid phase in the semi-liquid sta
te maintains the similar wettability as the single-phase liquid, the wettin
g balance tests are conducted with varying temperatures and compositions. T
he results are then compared with the surface tension of liquid, both measu
red and calculated, to examine the correlation. The results from this inves
tigation indicate that the partial melting can yield satisfactory solder jo
ints as long as the liquid phase acquires sufficient chemical activity. At
a condition where the partial melting is effective, a direct correlation be
tween the wettability and the surface tension is found to exist. All alloys
except two, Sn-Bi and Sn-In, are found to show a reasonable wettability in
semi-liquid state.