Analysis of ring and plug shear strengths for comparison of lead-free solders

Citation
Jc. Foley et al., Analysis of ring and plug shear strengths for comparison of lead-free solders, J ELEC MAT, 29(10), 2000, pp. 1258-1263
Citations number
5
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
JOURNAL OF ELECTRONIC MATERIALS
ISSN journal
03615235 → ACNP
Volume
29
Issue
10
Year of publication
2000
Pages
1258 - 1263
Database
ISI
SICI code
0361-5235(200010)29:10<1258:AORAPS>2.0.ZU;2-F
Abstract
The drive to replace the use of toxic lead metal and its alloys has spurred the development of many new lead-free solder alloys. Moreover, current lea ded solders lack shear strength, resistance to creep and to thermal-mechani cal fatigue. Solder that exhibits enhancements of these properties and reta ins solderability is crucial in applications where the solder joints are su bjected to thermal cycling, severe vibrations, and temperatures of up to 12 5 degrees C. Modified ring and plug joints were made with 18 selected lead- free solders and three well characterized lead-containing solders. Analysis of the results provides a guide for the design of additional testing.