TRENDS IN CONTAMINATION CONTROL IN IC PRODUCTION TOOLS

There is a gradual trend toward the application of minienvironments in IC production lines. The major motive is yield increase, as opposed t o the potential for cost reduction. Two approaches to minienvironment implementation are distinguished in this paper: tool-to-tool and intra tool. In the first case, standardized wafer carriers (for example, the standard mechanical interface [SMIF] type) keep the wafers clean duri ng transport in the fab. In the latter case, the wafers are kept clean once introduced into the tool, i.e,, during storage and transport of wafers inside the tool.