The effect of copper on gate oxide integrity

Citation
Yh. Lin et al., The effect of copper on gate oxide integrity, J ELCHEM SO, 147(11), 2000, pp. 4305-4306
Citations number
12
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
147
Issue
11
Year of publication
2000
Pages
4305 - 4306
Database
ISI
SICI code
0013-4651(200011)147:11<4305:TEOCOG>2.0.ZU;2-V
Abstract
We have studied the effect of copper contamination after the front-end meta l-oxide-semiconductor capacitor fabrication on gate oxide integrity. The si gnificant effect of Cu contamination on the pretunneling current, in combin ation with insensitive dependence of the Fowler-Nordheim tunneling current, oxide charge density, and breakdown field on the Cu concentration, suggest s that the current leakage mechanism may be due to neutral traps generated by Cu inside oxide. In addition to pretunneling oxide leakage, a small amou nt of Cu contamination increases the interface trap density that may degrad e the device performance. (C) 2000 The Electrochemical Society. S0013-4651( 00)03-073-1. All rights reserved.