Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric

Citation
Pt. Liu et al., Improvement of post-chemical mechanical planarization characteristics on organic low k methylsilsesquioxane as intermetal dielectric, J ELCHEM SO, 147(11), 2000, pp. 4313-4317
Citations number
18
Categorie Soggetti
Physical Chemistry/Chemical Physics","Material Science & Engineering
Journal title
JOURNAL OF THE ELECTROCHEMICAL SOCIETY
ISSN journal
00134651 → ACNP
Volume
147
Issue
11
Year of publication
2000
Pages
4313 - 4317
Database
ISI
SICI code
0013-4651(200011)147:11<4313:IOPMPC>2.0.ZU;2-S
Abstract
This work has investigated the electrical and material characteristics of p ost-chemical mechanical planarization (CMP) methylsilsesquioxane (MSQ). Exp erimental results have shown that the dielectric properties of low k MSQ de teriorate after the CMP process. However, by applying H-2-plasma post-treat ment, the degraded characteristics can be restored to a similar state as th at of a pre-CMP MSQ film. Material and electrical analyses were performed t o elucidate the detailed mechanisms of H-2-plasma treatment on post-CMP MSQ . H-2-plasma treatment provides active hydro en radicals to passivate the d angling bonds exposed in the MSQ after the CMP process. The hydrogen-rich p assivation layer is hydrophobic and effectively prevents further moisture u ptake. Therefore, a degradation-free CMP process can be achieved employing H-2-plasma treatment. (C) 2000 The Electrochemical Society. S0013-4651(00)0 4-098-2. All rights reserved.