Novel broadband microstrip to dielectric image line (DIL) transitions have
been developed. A conducting strip is flared linearly from the microstrip l
ine to the DIL. The DIL and microstrip substrate are on the same side of th
eir common ground plane. Theoretical Simulation results, obtained by using
the finite-difference time-domain method, agree well with experimental resu
lts, The transitions should have applications in the integration of the die
lectric image line with microwave integrated circuits (MICs) and monolithic
microwave integrated circuits (MMICs).