CMOS based imagers are beginning to compete against CCDs in many areas of t
he consumer market because of their system-on-a-chip capability, Sensitivit
y, however, is a main weakness of CMOS imagers and enhancements and deviati
ons from standard CMOS processes are necessary to keep up sensitivity with
downscaled process generations.
In the introductory section several definitions for the sensitivity of imag
e sensors are reviewed with regard to their potential to allow meaningful c
omparison of different detector structures. In the main section, the standa
rd CMOS sensor architecture is compared to detector structures designed to
improve the sensitivity, namely the photogate (PG), the pinned photodiode (
PPD) and the thin film on ASIC (TFA) approach. The latter uses a vertical i
ntegration of the photodiode on top of the pixel transistors. A careful ana
lysis of the relevant electrical, optical and technological parameters and
many previously published experimental data for different imagers reveals t
hat only the PPD and the TFA enhancements provide satisfactory sensitivity
and withstand scaling down to 0.18 mu processes. Due to the higher fill fac
tor and the higher quantum efficiency TFA provides significantly better val
ues than PPD, The radiometric sensitivity of a 5 mum x 5 mum TFA pixel is f
ound to amount to 11.9 V/(muJ/cm(2)) for a 0.25 mum process and 27.5 V/(muJ
/cm(2)) for a 0.18 mum process.