Metal-glazed thick-film resistors fired at low temperature on glass substrate

Conventional metal-glazed thick-film resistors are applied to Hybrid Integr ated Circuits, chip resistors and others. These resistors are usually fired at a high temperature of around 850 degreesC on ceramic substrates. Recent ly, however, attempts have been made to fire some metal-grazed thick-film r esistors at lower temperatures on glass substrates for application as the c ontrol resistors for the discharge current of de Plasma Display Panels (PDP s). We have attempted to realize such low-firing-temperature thick-film res istors using Pb-2 Rut O7-x as Conductive particles, two kinds of lead-boros ilicate grasses as binders: and three kinds of metallic oxide as additives, which are fired at 580 degreesC on a soda lime glass substrate. The electr ical properties of the specimens, 16 kinds in all, fabricated from various combinations of binder glasses, additives and electrode materials have been measured. Effective dimensions of the specimen resistor are 0.25 x 0.25 mm (2) or less in surface area, since extremely small size is required by PDPs . The effect of the combination of additive and binder glass on the conduct ive particles of Pb2Ru2 O7-x has been examined in detail, together with the affinity for electrical conjunction between resistor and electrode.