Raman studies were carried out on GaAs samples which were double implanted
with Si and subjected to rapid thermal annealing (RTA) at temperatures of 9
00 degreesC for 25 s (Sample-A), 925 degreesC for 15 s (B) and 950 degreesC
for 6 s (C). In order to study the diffusion profiles of these implanted d
opants, the dopant concentration vs depth of all the three samples were obt
ained by secondary ion mass spectrometry (SIMS) studies. From the Raman stu
dies, it is observed that the LO phonon mode interacts with the plasmons re
sulting in L+ and L- phonon-plasmon modes in all the three samples. Further
, from the peak value of these L+ and L- phonon-plasmon modes, the active c
arrier concentration in the samples using the plasmon frequency versus carr
ier concentration curve were found to be 4.49 x 10(17), 7.06 x 10(17) and 4
.70 x 10(17) cm(-3), respectively. These values are compared with the dopan
t concentration as obtained from the SIMS depth analysis. It is observed th
at dopant concentration obtained through SIMS is higher than the carrier co
ncentration obtained from Raman studies in samples A and B, but in sample C
these concentrations are nearly the same. SIMS data further shows that the
diffusion of Si is highest in sample C. Raman studies show that the carrie
r concentration is highest in sample B which agrees well with the concentra
tion obtained from the Hall effect and electrical conductivity measurements
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