Effects of high-temperature annealing conditions on minority-carrier-lifeti
me variation have been investigated for multicrystalline Si wafers. Lifetim
e recovery peaks appear obviously at temperatures over 1000 degreesC for th
e multicrystalline Si wafers, which is the same as for FZ and CZ single waf
ers. Bulk lifetimes degrade after a further long-time annealing in oxygen.
This suggests that there exists the filling of vacancies with interstitial
Si atoms generated at the Si surfaces during high-temperature annealing. (C
) 2001 Elsevier Science B.V. All rights reserved.