C. Palacio et A. Arranz, Electronic structure and interface formation during nickel deposition on polycrystalline aluminum, J PHYS CH B, 104(41), 2000, pp. 9647-9652
The deposition of nickel on polycrystalline aluminum substrates has been st
udied at room temperature by X-ray photoelectron spectroscopy (XPS), angle-
resolved X-ray photoelectron spectroscopy (ARXPS), and valence band X-ray p
hotoelectron spectroscopy (VBXPS). The growth of the nickel on the aluminum
surface has been found to occur in two stages: Formation of NiAlx (x appro
ximate to 0.45) islands 10 ML thick up to a coverage theta (NiAlx) = 0.7, f
ollowed by the formation of metallic nickel islands with constant thickness
of 8 ML that grow over the intermetallic islands previously formed. The si
multaneous lateral growth of both kinds of islands is also observed during
the second stage. During the first stage, the VBXPS spectra suggest a net c
harge transfer from nickel to aluminum with the sequential formation of NiA
l3, Ni2Al3, NiAl, and Ni3Al phases.