New approaches in the transient thermal measurements

In the first part of the paper a thermal transient measurement approach is presented that can be applied for the generation of multi-port compact dyna mic thermal models of IC packages. Experimental results prove the applicabi lity of the ideas. In the second part of the paper the recent advances in t he development of the appropriate measurement tools are described. Among ot hers the authors present a new thermal transient test chip, and T3ster, a n ew thermal transient tester equipment, developed for high precision one-por t or multi-port transient thermal measurements. (C) 2000 Elsevier Science L td. All rights reserved.