A search for non-cyanide plating baths for copper resulted in the developme
nt of alkaline copper complex baths containing trisodium citrate [TSC] and
triethanolamine [TEA]. Voltammetric studies were carried out on platinum to
understand the electrochemical behaviour of these complexes. In TSC soluti
ons, the deposition of copper involves the slow formation of a monovalent s
pecies. Adsorption of this species obeys Langmuir isotherm. in TEA solution
s the deposition involves the formation of monovalent ions obeying the non-
activated Temkin isotherm. Conversion of divalent to monovalent copper is a
lso slow, in TEA and TSC alkaline copper solutions, the predominant species
that undergo stepwise reduction contain only TEA ligands.