Fabrication of semiconductor optical switch module using laser welding technique

Citation
Sg. Kang et al., Fabrication of semiconductor optical switch module using laser welding technique, IEEE T AD P, 23(4), 2000, pp. 672-680
Citations number
11
Categorie Soggetti
Material Science & Engineering
Journal title
IEEE TRANSACTIONS ON ADVANCED PACKAGING
ISSN journal
15213323 → ACNP
Volume
23
Issue
4
Year of publication
2000
Pages
672 - 680
Database
ISI
SICI code
1521-3323(200011)23:4<672:FOSOSM>2.0.ZU;2-R
Abstract
The 4 x 4, 1 x 2, and 1 x 4 semiconductor optic-switch modules for 1550 nm optical communication systems were fabricated by using the laser welding te chnique based on the 30-pin butterfly package. For better coupling efficien cy between a switch chip and an optical fiber, tapered fibers of 10-15 mum lens radius were used to provide the coupling efficiency up to 60%. The len s to lens distance of the assembled tapered fiber array was controlled with in +/-1.0 mum. A laser hammering technique was introduced to adjust the rad ial shift, which was critical to obtain comparable optical coupling efficie ncies from all the channels at the same time. The fabricated optical switch modules showed good thermal stability, with less than 5% degradation after a 200 thermal cycling. The transmission characteristics of the 4 x 4 snitc h module showed good sensitivities, providing error free transmissions belo w -30 dBm for all the switching paths, The dynamic ranges for the 4 x 4 and 1 x 2 snitch modules were about 8 dB for a 3 dB penalty and about 17 dB fo r a 2 dB penalty, respectively.