Effect of current crowding on contact failure in heavily doped n(+)- and p(+)-silicon-on-insulator

Citation
Js. Huang et al., Effect of current crowding on contact failure in heavily doped n(+)- and p(+)-silicon-on-insulator, J MATER RES, 15(11), 2000, pp. 2387-2392
Citations number
17
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science","Material Science & Engineering
Journal title
JOURNAL OF MATERIALS RESEARCH
ISSN journal
08842914 → ACNP
Volume
15
Issue
11
Year of publication
2000
Pages
2387 - 2392
Database
ISI
SICI code
0884-2914(200011)15:11<2387:EOCCOC>2.0.ZU;2-4
Abstract
Stability of submicron contacts under high current density has been an outs tanding reliability issue in advanced Si devices. Polarity effect of failur e was observed in Ni and Ni2Si contacts on n(+)-Si and p(+)-Si, In this rep ort, we studied the failure due to high current density in contacts to n(+) - and p(+)-silicon-on-insulator (SOI), We found similar polarity effects be low certain current: the p(+)-SOI failed preferentially at the cathode, whi le the n(+)-SOI failed preferentially at the anode. At higher current, dama ge occurred at both contacts. The effect of current crowding was evident in both cases.