Js. Huang et al., Effect of current crowding on contact failure in heavily doped n(+)- and p(+)-silicon-on-insulator, J MATER RES, 15(11), 2000, pp. 2387-2392
Stability of submicron contacts under high current density has been an outs
tanding reliability issue in advanced Si devices. Polarity effect of failur
e was observed in Ni and Ni2Si contacts on n(+)-Si and p(+)-Si, In this rep
ort, we studied the failure due to high current density in contacts to n(+)
- and p(+)-silicon-on-insulator (SOI), We found similar polarity effects be
low certain current: the p(+)-SOI failed preferentially at the cathode, whi
le the n(+)-SOI failed preferentially at the anode. At higher current, dama
ge occurred at both contacts. The effect of current crowding was evident in
both cases.