Pentacene thin-film transistors(TFTS) were fabricated on glass substrates.
Aluminum andgold were used for gale and source/drain electrodes. Silicon di
oxide was deposited as a gate insulator by PECVD and patterned by reactive
ion etching(RIE). The semiconducting pentacene layer was thermally evaporat
ed in vacuum at a pressure of about 10(-8) Torr and a deposition rate of 0.
3 Angstrom /sec. The fabricated devices exhibited the field-effect mobility
as large as 0.07 cm(2)/V sec, threshold voltage as low as -3.3V, and the o
n/off current ratio larger than 10(7).