AlGaN/GaN high electron mobility transistor structure design and effects on electrical properties

Citation
El. Piner et al., AlGaN/GaN high electron mobility transistor structure design and effects on electrical properties, MRS I J N S, 5, 2000, pp. NIL_299-NIL_303
Citations number
5
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
MRS INTERNET JOURNAL OF NITRIDE SEMICONDUCTOR RESEARCH
ISSN journal
10925783 → ACNP
Volume
5
Year of publication
2000
Supplement
1
Pages
NIL_299 - NIL_303
Database
ISI
SICI code
1092-5783(2000)5:<NIL_299:AHEMTS>2.0.ZU;2-Z
Abstract
We report on the effect of strain induced polarization fields in AlGaN/GaN heterostructures due to the incorporation of Si dopant ions in the lattice. By Si-doping (Al)GaN, a contraction of the wurtzite unit cell can occur le ading to strain in doped AlGaN/GaN heterostructures such as high electron m obility transistors (HEMTs). In a typical modulation doped AlGaN/GaN HEMT s tructure, the Si-doped AlGaN supply layer is separated from the two-dimensi onal electron gas channel by an undoped AlGaN spacer layer. This dopant-ind uced strain, which is tensile, can create an additional source of charge at the AlGaN:Si/AlGaN interface. The magnitude of this strain increases as th e Si doping concentration increases and the AlN mole fraction in the AlGaN decreases. Consideration of this strain should be given in AlGaN/GaN HEMT s tructure design.