Thermal expansion of GaN at low temperatures - a comparison of bulk and homo- and heteroepitaxial layers

Citation
V. Kirchner et al., Thermal expansion of GaN at low temperatures - a comparison of bulk and homo- and heteroepitaxial layers, MRS I J N S, 5, 2000, pp. NIL_335-NIL_340
Citations number
11
Categorie Soggetti
Apllied Physucs/Condensed Matter/Materiales Science
Journal title
MRS INTERNET JOURNAL OF NITRIDE SEMICONDUCTOR RESEARCH
ISSN journal
10925783 → ACNP
Volume
5
Year of publication
2000
Supplement
1
Pages
NIL_335 - NIL_340
Database
ISI
SICI code
1092-5783(2000)5:<NIL_335:TEOGAL>2.0.ZU;2-K
Abstract
The thermal expansion of different GaN samples is studied by high-resolutio n Xray diffraction within the temperature range of 10 to 600 K. GaN bulk cr ystals, a homoepitaxial layer and different heteroepitaxial layers grown by metalorganic chemical vapor deposition (MOCVD) and molecular beam epitaxy (MBE) were investigated. Below 100 K the thermal expansion coefficients (TE C) were found to be nearly zero which has to be taken into account when est imating the thermal strain of GaN layers in optical experiments commonly pe rformed at low temperatures. The homoepitaxial layer and the underlying GaN substrate with a lattice mismatch of -6.10(4) showed identical thermal exp ansion. The comparison between the temperature behavior of lattice paramete rs of heteroepitaxial layers and bulk GaN points to a superposition of ther mally induced biaxial strain and compressive hydrostatic strain.