Ti/Pt/Au metallization on p-type GaN/AlxGa1-xN (x=0.10 and 0.20) superlatti
ces (SL) were investigated as ohmic contacts. Current-voltage and specific
contact resistance measurements indicate enhanced p-type doping in the supe
rlattice structures compared to that in GaN. Ti/Pt/Au is shown to be an eff
ective ohmic metallization scheme on p-type GaN/AlxGa1-xN superlattices. A
specific contact resistance of R-c = 4.6x10(-4) Omega -cm(2) is achieved fo
r unalloyed Ti/Pt/Au on GaN/Al0.2Ga0.8N SL. This is reduced to 1.3x10(-4) O
mega -cm(2) after annealing for 5 minutes at 300 degreesC.