We have shown that Zr-based metallization can effectively remove hydrogen f
rom the p-type GaN subsurface, which eventually leads to the formation of a
n ohmic contact. As the release of hydrogen starts at similar to 900 degree
sC, the thermal stability of the contact system is of particular importance
. The remarkable thermal behavior of the ZrN/ZrB2 metallization is associat
ed to the microstructure of each individual Zr-based compound, as well as t
o the interfacial crystalline accommodation.